JPH023603Y2 - - Google Patents
Info
- Publication number
- JPH023603Y2 JPH023603Y2 JP17585284U JP17585284U JPH023603Y2 JP H023603 Y2 JPH023603 Y2 JP H023603Y2 JP 17585284 U JP17585284 U JP 17585284U JP 17585284 U JP17585284 U JP 17585284U JP H023603 Y2 JPH023603 Y2 JP H023603Y2
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- solder
- circuit board
- recess
- solder bump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 5
- 230000004907 flux Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17585284U JPH023603Y2 (en]) | 1984-11-20 | 1984-11-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17585284U JPH023603Y2 (en]) | 1984-11-20 | 1984-11-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6190206U JPS6190206U (en]) | 1986-06-12 |
| JPH023603Y2 true JPH023603Y2 (en]) | 1990-01-29 |
Family
ID=30733454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17585284U Expired JPH023603Y2 (en]) | 1984-11-20 | 1984-11-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH023603Y2 (en]) |
-
1984
- 1984-11-20 JP JP17585284U patent/JPH023603Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6190206U (en]) | 1986-06-12 |
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